Chapter 1: Introduction Chapter 2: The Electrical Engineering Problem Chapter 3: Major Elements in an Electronic System Chapter 4: Assumptions Often Made About Electronic Systems Chapter 5: How Real Systems and Their Components Are Far From Ideal Chapter 6: Transmission Lines Chapter 7: What’s Moving on a Transmission Line? Chapter 8: Basics of Electromagnetic Fields Chapter 9: Digital vs. Rf/Microwave vs. Analog Chapter 10: Time and Distance Chapter 11: Inductance Chapter 12: Capacitance Chapter 13: Resistance Chapter 14: Fundamentals of Transmission Lines Chapter 15: The Concept of Ground and Power Planes Chapter 16: Impedance Chapter 17: Reflections – What Causes Them and What They Do to a Signal Chapter 18: What is Meant by Signal Integrity Engineering Chapter 19: When is a Design High-Speed? Chapter 20: Controlling Reflections By Using Terminations Chapter 21: Terminator Type, Terminator Placement and Net Sequencing Chapter 22: Stubs on Transmission Lines? Chapter 23: Properties of Transmission Lines That Affect Impedance Chapter 24: Methods For Calculating and Measuring Impedance Chapter 25: Right-Angle Bends and Vias: Potential Sources of Reflections and Other Problems Chapter 26: Types of Drivers or Sources Chapter 27: Types of Loads Chapter 28: Bus Protocols Chapter 29: Crosstalk or Coupling? Chapter 30: Single-Ended Signaling Chapter 31: Differential Signaling Chapter 32: The Power Subsystem Chapter 33: Power Distribution DC Drop Chapter 34: Decoupling Capacitors Chapter 35: Power Subsystem Inductance Chapter 36: Power Dissipation Estimate Chapter 37: Example Power Subsystem Design Chapter 38: IC Packages – Vcc and Ground Bounce or SSN Chapter 39: Noise Margins Chapter 40: Design Rule Creation Using Noise Margin Analysis Chapter 41: The PCB Fabrication Process Chapter 42: PCB Materials Chapter 43: Creating PCB Stackups Chapter 44: Types of Vias Chapter 45: PCB Design Process Chapter 46: PCB Routing Chapter 47: Documentation Chapter 48: The Ideal Component Data Sheet