Chapter 38 Summary: IC Packages - Vcc and Ground Bounce, or SSN
Chapter 38 covers the effects of package parasitic inductance upon the performance of high-speed logic circuits. The author discusses how to create a test setup for measuring worst-case Vcc and ground bounce. The reader will understand why Vcc and ground bounce (simultaneous switching noise, or SSN) are caused by excessive inductance in the power paths of the IC packages, and why nothing can be implemented on the PCB to fix this problem – changing to an IC with lower-power lead inductance is necessary.
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