Chapter 44 Summary: Types of Vias In Chapter 44, the three basic types of vias – through-hole vias, blind vias and buried vias – are investigated, along with their limitations and benefits. Processes such as photo-imaging and laser-drilling are also discussed, along with cost tradeoffs. Because it costs the same to form 10,000 photo-imaged vias as it does to form on, PCBs with a few blind vias are best drilled, while board with large numbers of blind vias are best photo-defined.
Previous Chapter | Next Chapter