Chapter 32 Summary: The Power Subsystem This chapter details the “ideal” power subsystem, as well as the types designers are likely to face today. The power distribution system is becoming increasingly more difficult to design as CMOS technology leads to lower power supply voltages, more power per chip, and higher clock frequencies. Readers will discover the design challenges that different power subsystems present, as well as methods for combating these problems. Even PCB stackup can help reduce power distribution system problems; proper board stackup can help produce the capacitance necessary for frequencies above 200 MHz.
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